The financing of AI infrastructure is moving from internal cash flows to debt markets.
Nine large hyperscalers issued USD 122 billion in bonds in 2025, almost half of global technology issuance (OECD, 2026a). Their share of global investment-grade bond issuance has risen from less than 1% to 10% since 2024 (IMF, 2026).
Much of this debt is secured on assets that can lose value much faster than real estate.
Around 60% of data centre investment goes to chips and computing hardware (McKinsey, 2025). New chip generations arrive roughly every year, while the debt that finances them has maturities of 3 to 23 years.
Technology risk can reach credit through five channels.
These are hardware obsolescence, revenue deflation, vendor financing, offtaker concentration and refinancing risk. Early evidence is mixed. H100 rental prices rose by about 44% between December 2025 and October 2026, while token prices fell by about 50% year on year, which points to margin pressure in the middle of the chain.
Credit markets started to reprice the risk in October 2026.
Yields on some neocloud bonds approached 15-16%, and these firms were effectively shut out of the bond market (WSJ, 2026a). Within the same ecosystem, the gap in borrowing costs between debt backed by an investment-grade supplier and unsecured debt ranges from about 4 to 10 percentage points.
Risk is moving from banks to insurers, pension funds and private credit funds.
Private credit to AI-related firms exceeds USD 200 billion and could reach USD 300-600 billion by 2030 (BIS, 2026a). In the euro area, insurers and pension funds would be the most affected sectors in a severe private credit shock.
Financial institutions depend on the same AI providers both as users and as creditors.
This double exposure may call for joint monitoring of third-party risk and credit risk. Leases signed but not yet commenced exceed USD 1.4 trillion at five companies alone, which makes consistent disclosure more important.
This paper examines how the technology cycle of artificial intelligence (AI) may affect the quality of the debt that finances AI infrastructure, and where in the financial system this risk accumulates. The paper does not assess whether AI equity valuations are excessive. Instead, it maps the transmission channels and exposures that are relevant however valuations evolve.
01
Investment needs are large and increasingly financed with debt
Global data centre capacity is estimated to require USD 6.7 trillion of investment by 2030 (McKinsey, 2025). According to the International Monetary Fund (IMF), around USD 2.9 trillion of investment expected by 2028 will be financed through a mix of cash flows, bank lending, , public debt and securitisation (IMF, 2026). OECD analysis also shows that technology companies are becoming larger issuers in debt markets (OECD, 2026a).
02
The value of the collateral and the revenues that service the debt depend on technology
A large part of this debt is secured on hardware such as graphics processing units (GPUs) and tensor processing units (TPUs), whose value can fall with each new chip generation, or on long-term contracts with a few large buyers. At the same time, the rapid fall in token prices and the wider use of cheaper open-weight models put pressure on revenues at the end of the chain. Only about 6% of organisations report a material profit gain from AI (McKinsey, 2026).
03
Credit markets have started to price the risk, and the risk is moving outside banks
In October 2026, borrowing costs for some rose sharply and their access to the bond market narrowed. Banks have started to transfer data centre loans to private credit funds, asset managers and insurers (CNBC, 2026a). As a result, risk may accumulate in less transparent institutions with long-term liabilities.
04
Transparency, data and joint monitoring are the main policy areas
Financial authorities should encourage more consistent disclosure of off-balance-sheet obligations linked to AI, drawing on the G20/OECD Principles of Corporate Governance. Supervisors could consider reviewing valuation assumptions for hardware collateral, measuring indirect exposures held through private credit funds and including AI scenarios in stress tests. The OECD can support this work through its comparative data and the Committee on Financial Markets.
This chapter examines the scale of investment needed for AI infrastructure and the changes in how this investment is financed. It draws on data from the OECD, the IMF and McKinsey, and sets out the scope of the paper.
1
Figure 1.1. Data centre investment needs, 2025-2030
Lower scenario (AI, low end of range), USD trillion (cumulative, 2025-2030): ≈ 3.0. Central scenario (continued momentum), USD trillion (cumulative, 2025-2030): 6.7 (of which USD 5.2 trillion for ai workloads). Upper scenario (accelerated demand, AI), USD trillion (cumulative, 2025-2030): 7.9.
Note: The lower and upper scenarios cover AI workloads only. The value for the lower scenario is the approximate low end of the range reported by McKinsey.
Source: McKinsey (2025), The cost of compute: A $7 trillion race to scale data centers.
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Figure 1.1. Data centre investment needs, 2025-2030: data
Projected investment in data centres is far above recent levels of infrastructure spending. In the central scenario of McKinsey, total investment of USD 6.7 trillion is needed by 2030, of which USD 5.2 trillion is for AI workloads (Figure 1.1).
Estimates across scenarios range from about USD 3 trillion to USD 8 trillion, which reflects high uncertainty about future AI demand.
The composition of this investment matters for credit risk. Around 60% of AI-related investment, or USD 3.1 trillion, goes to firms that produce chips and computing hardware (McKinsey, 2025). These assets can become obsolete much faster than buildings and energy infrastructure.
Note: The lower and upper scenarios cover AI workloads only. The value for the lower scenario is the approximate low end of the range reported by McKinsey.
Source: McKinsey (2025), The cost of compute: A $7 trillion race to scale data centers.
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Figure 1.1. Data centre investment needs, 2025-2030: data
Figure 1.2. Hyperscaler borrowing and weight in bond markets
A. Debt issuance by five hyperscalers (USD billion), Period: 2020-2024 annual average, Value: ≈ 30. A. Debt issuance by five hyperscalers (USD billion), Period: 2025, Value: 121. B. Hyperscalers’ share of global investment-grade bond issuance (%), Period: Before 2024, Value: < 1. B. Hyperscalers’ share of global investment-grade bond issuance (%), Period: 2026, Value: 10.
Note: The 2020-2024 average in Panel A is derived from the statement that 2025 issuance was about four times the average of the previous five years. Panel A covers Amazon, Alphabet, Meta, Microsoft and Oracle.
Source: Panel A: Bank of America, via Fortune (2025). Panel B: IMF (2026), Global Financial Stability Report, October 2026.
View data table
Figure 1.2. Hyperscaler borrowing and weight in bond markets: data
Panel
Period
Value
A. Debt issuance by five hyperscalers (USD billion)
2020-2024 annual average
≈ 30
A. Debt issuance by five hyperscalers (USD billion)
2025
121
B. Hyperscalers’ share of global investment-grade bond issuance (%)
Before 2024
< 1
B. Hyperscalers’ share of global investment-grade bond issuance (%)
Hyperscalers increasingly finance their investment with debt. According to the OECD Global Debt Report 2026, nine large hyperscalers issued USD 122 billion in bonds in 2025, and their planned capital expenditure for 2026-2030 reaches USD 4.1 trillion (OECD, 2026a).
Data from Bank of America show that debt issuance by the five largest hyperscalers in 2025 was about four times the annual average of the previous five years (Figure 1.2, Panel A).
This trend also affects the structure of bond markets. The IMF reports that the share of hyperscalers in global investment-grade bond issuance has risen from less than 1% to 10% since 2024, while their free cash flow has declined (IMF, 2026).
The OECD Economic Outlook notes that risks could be repriced if expected returns from AI do not materialise, and that forced sales by leveraged non-bank financial institutions could amplify this process (OECD, 2025).
Note: The 2020-2024 average in Panel A is derived from the statement that 2025 issuance was about four times the average of the previous five years. Panel A covers Amazon, Alphabet, Meta, Microsoft and Oracle.
Source: Panel A: Bank of America, via Fortune (2025). Panel B: IMF (2026), Global Financial Stability Report, October 2026.
View data table
Figure 1.2. Hyperscaler borrowing and weight in bond markets: data
Panel
Period
Value
A. Debt issuance by five hyperscalers (USD billion)
2020-2024 annual average
≈ 30
A. Debt issuance by five hyperscalers (USD billion)
2025
121
B. Hyperscalers’ share of global investment-grade bond issuance (%)
Before 2024
< 1
B. Hyperscalers’ share of global investment-grade bond issuance (%)
This paper focuses on how technology risk in AI infrastructure finance may turn into credit risk. Chapter 2 describes the financing chain. Chapter 3 examines five channels through which technology risk can reach credit. Chapter 4 reviews recent pricing in credit markets, Chapter 5 identifies who holds the risk and Chapter 6 discusses transparency and the double exposure of financial institutions. Chapter 7 presents policy considerations.
The paper does not forecast prices or defaults, and it does not assess the solvency of individual firms. Company names are used only as examples of transactions documented in public sources.
This chapter describes the path that funding for AI infrastructure follows, from long-term investors to end users. It draws on analysis by the Bank for International Settlements (BIS) and on one documented transaction.
2
Figure 2.1. The AI infrastructure financing chain and points where risk enters
Long-term investors: Insurers, pension funds, credit funds, Where technology risk enters: Refinancing risk: At every link of the chain. Debt instruments: Bonds, SPVs, GPU-backed loans, ABS, Where technology risk enters: Hardware obsolescence: Collateral loses value. Infrastructure owners: Data centre SPVs, neoclouds, Where technology risk enters: Vendor financing: Demand signal becomes unclear. Capacity buyers: Hyperscalers, AI developers (take-or-pay), Where technology risk enters: Offtaker concentration: Ratings rest on a few contracts. End users: Firms and households paying per token, Where technology risk enters: Revenue deflation: Token prices fall.
Note: Orange boxes show where technology risk enters the chain. Refinancing risk can arise at every link.
Source: Author’s analysis, based on BIS (2026a, 2026b).
View data table
Figure 2.1. The AI infrastructure financing chain and points where risk enters: data
The financing of AI infrastructure can be described as a chain with five links (Figure 2.1).
Long-term investors provide funds to data centre owners through instruments such as bonds, and credit funds. These assets are leased to hyperscalers and AI developers that buy capacity under long-term contracts. The whole chain ultimately depends on what end users pay for AI services.
The BIS finds that off-balance-sheet structures strengthen the links between hyperscalers and non-bank investors such as vehicles and insurers (BIS, 2026b). The BIS also notes that the terms of these arrangements are often poorly disclosed, and that the same asset may be pledged as collateral more than once.
Note: Amounts are approximate. Broadcom has also agreed to lend Anthropic up to USD 42 billion in convertible notes restricted to TPU lease payments; the Anthropic prospectus discloses this as a potential conflict of interest.
Source: The Paypers (2026); FT (2026), via Dealroom; Implicator (2026a).
View data table
Figure 2.2. Tranche structure of the TPU lease financing: data
A transaction of about USD 35 billion closed in June 2026 shows several links of the chain in one structure (Figure 2.2). arranged by Apollo and Blackstone finances the purchase of Google-designed TPUs that are leased to Anthropic.
Two senior tranches are backstopped by Broadcom, which co-develops the chips with Google, and carry a coupon of about 5.75%. A junior tranche of about USD 4.5 billion carries the credit risk of the tenant and was sold at about 8.5% (The Paypers, 2026).
The structure illustrates two points. First, the rating often depends on the credit quality of the guarantor or buyer rather than on the value of the collateral. KBRA rated the junior tranche BB+, based on limited information selected by the company (FT, 2026). Second, Broadcom’s liability under the backstop is calculated as 85% of amounts outstanding minus the sale value of the hardware (Implicator, 2026a). The market value of the collateral therefore determines directly how losses would be shared.
Note: Amounts are approximate. Broadcom has also agreed to lend Anthropic up to USD 42 billion in convertible notes restricted to TPU lease payments; the Anthropic prospectus discloses this as a potential conflict of interest.
Source: The Paypers (2026); FT (2026), via Dealroom; Implicator (2026a).
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Figure 2.2. Tranche structure of the TPU lease financing: data
This chapter identifies five channels through which the features of AI technology may affect the quality of infrastructure debt. For each channel, it presents current evidence and the credit variables that could be measured.
3
Table 3.1. Five channels through which technology risk reaches credit
Channel
Mechanism
Variable to measure
Hardware obsolescence
New chip generations reduce the value of hardware used as collateral.
Loan maturity compared with economic life; loan-to-value ratio
Revenue deflation
Falling token prices and cheaper models reduce the revenues that service the debt.
Token price indices; debt service coverage ratio
Vendor financing
Chip suppliers finance or guarantee their own buyers, which makes the signal of end demand less clear.
Share of contracts with supplier financing or guarantees
Offtaker concentration
Ratings rest on contracts with a few large buyers.
Share of debt serviced by the five largest buyers
Refinancing
Borrowers must keep raising new debt; stress can start before collateral loses value if markets close.
Maturity profile; annual refinancing needs
Source: Author’s analysis.
Figure 3.1. Debt maturities and chip generations
Hopper 2022, Type: Nvidia data centre chip generation (release year). Blackwell 2024, Type: Nvidia data centre chip generation (release year). Rubin 2026, Type: Nvidia data centre chip generation (release year). Rubin Ultra 2027, Type: Nvidia data centre chip generation (release year). Feynman 2028, Type: Nvidia data centre chip generation (release year). GPU-backed loans (3-5 years), Type: Maturity range of a documented transaction. TPU lease financing (5 years), Type: Maturity range of a documented transaction. Neocloud bonds (maturing 2030-2033), Type: Maturity range of a documented transaction. Compute leases (weighted average 10 years), Type: Maturity range of a documented transaction. Hyperion SPV bond (maturing 2049), Type: Maturity range of a documented transaction.
Highlights only · no new figures
Highlights only · no new figures
Note: Dashed lines show the release years of Nvidia data centre chip generations. Bars show the maturity ranges of documented transactions.
Debt maturities span several chip generations (Figure 3.1).
Nvidia plans to release a new data centre chip about every year.
By contrast, usually have maturities of three to five years, and some data centre bonds run until 2049.
One market analysis finds that the main risk in this type of financing has shifted from obtaining GPUs to managing their rapid obsolescence (ENKI, 2026).
Note: Dashed lines show the release years of Nvidia data centre chip generations. Bars show the maturity ranges of documented transactions.
A. H100 rental price, Series: Late 2024 peak, Value: ≈ 8.00 USD per GPU-hour. A. H100 rental price, Series: Jun 2025, Value: 2.36 USD per GPU-hour. A. H100 rental price, Series: Dec 2025, Value: 2.00 USD per GPU-hour. A. H100 rental price, Series: Oct 2026, Value: 2.88 USD per GPU-hour. B. Change (%), Series: H100 rent (Dec 2025-Oct 2026), Value: +44%. B. Change (%), Series: Token prices (year on year), Value: -50%. B. Change (%), Series: Token prices (4 weeks, Sep-Oct 2026), Value: -25.4%.
Note: The series in Panel A are compiled from different sources: the late 2024 peak is based on market listings, and other values on Silicon Data H100 indices. Changes in Panel B cover different periods.
Source: Introl (2025); Silicon Data; YipitData and Ramp AI Index, via FourWeekMBA (2026a).
View data table
Figure 3.2. GPU rental prices and token prices: data
Rental prices and token prices are moving in opposite directions (Figure 3.2).
The rental price of H100 GPUs fell sharply from its peak in late 2024 to mid-2025, but rose by about 44% between December 2025 and October 2026.
Over the same period, token prices fell by about 50% year on year (FourWeekMBA, 2026a).
This suggests that the value of the collateral has not collapsed, but that margins are narrowing for firms that rent hardware and sell tokens.
Price data have limited reliability. Different GPU price indices can show values up to eight times apart for the same chip (Implicator, 2026b), which makes it harder to verify the assumptions used to value collateral. Plans by CME and ICE to launch futures contracts on computing capacity could provide a more transparent price reference over time.
Note: The series in Panel A are compiled from different sources: the late 2024 peak is based on market listings, and other values on Silicon Data H100 indices. Changes in Panel B cover different periods.
Source: Introl (2025); Silicon Data; YipitData and Ramp AI Index, via FourWeekMBA (2026a).
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Figure 3.2. GPU rental prices and token prices: data
Organisations using AI in at least one function, Value: 89%. Respondents reporting higher individual productivity, Value: 80%. Organisations scaling AI across the enterprise, Value: 44%. Organisations attributing any EBIT impact to AI, Value: 37%. Organisations attributing 5% or more of EBIT to AI, Value: 6%.
Note: The survey was conducted in May and June 2026 among 1 719 executives. Data are self-reported.
Source: McKinsey (2026), The state of AI in 2026: On the road to ROI.
Revenues at the end of the chain depend on the returns that enterprise users obtain from AI.
In a McKinsey survey of 1 719 executives, 89% of organisations use AI, but only 37% attribute any impact on earnings before interest and taxes (EBIT) to it (Figure 3.3).
Figure 3.3Organisations scaling AI across the enterprise
Figure 3.3Organisations attributing any EBIT impact to AI
The share of organisations attributing at least 5% of EBIT to AI stood at 6%, unchanged since 2025 (McKinsey, 2026). Users that cannot show a return may reduce spending or move to cheaper models.
Note: The survey was conducted in May and June 2026 among 1 719 executives. Data are self-reported.
Source: McKinsey (2026), The state of AI in 2026: On the road to ROI.
Chip suppliers increasingly finance or guarantee the firms that buy their products. According to summaries of IMF analysis, hyperscalers have channelled about USD 300 billion in equity and USD 650 billion in debt into weaker AI firms (IMF, 2026). Supplier-linked financing platforms are estimated at about USD 500 billion (Steffen, 2026). Such arrangements may make it harder to assess how much demand comes from independent customers.
3.5Offtaker concentration and refinancing
Investment-grade ratings often rest on contracts with a few large buyers. For example, a USD 8.5 billion CoreWeave facility received an A3 rating on the strength of a hyperscaler contract, and Meta’s Hyperion carries USD 27 billion of A+ rated debt outside Meta’s balance sheet (Steffen, 2026). A change in the credit quality of one buyer could therefore affect many debt instruments at the same time. In addition, most of these firms need to keep borrowing for years, so a loss of market access could cause stress before collateral loses value.
This chapter examines the divergence in borrowing costs across the AI ecosystem and market developments in October and November 2026. It combines analysis by the IMF and the BIS with recent market data.
4
Figure 4.1. Borrowing costs across the AI ecosystem
TPU financing, senior (Broadcom backstop), Coupon or yield (%): 5.75%, Colour: investment-grade guarantee or rating. Investment-grade GPU facilities, Coupon or yield (%): ≈ 5.9%, Colour: investment-grade guarantee or rating. TPU financing, junior tranche (BB+), Coupon or yield (%): ≈ 8.5%, Colour: speculative grade. SpaceX/xAI chip debt, highest tranche, Coupon or yield (%): 8.75%, Colour: speculative grade. CoreWeave unsecured notes (Jun 2026), Coupon or yield (%): 9.625%, Colour: speculative grade. Early GPU-backed loans, Coupon or yield (%): ≈ 15%, Colour: high stress. CoreWeave 2030-2032 notes (Oct 2026, implied), Coupon or yield (%): ≈ 15.5%, Colour: high stress.
Note: Values refer to different dates and instruments and should be read as indications of scale rather than direct comparisons. Blue: investment-grade guarantee or rating; orange: speculative grade; red: high stress.
Borrowing costs within the same ecosystem differ widely depending on who stands behind the debt (Figure 4.1).
Debt backed by an investment-grade supplier is priced at about 5.75%, while junior tranches stand at 8.5-8.75%.
The cost of unsecured debt rose from 9.625% in June 2026 to an implied 15-16% in October 2026 (Crypto Briefing, 2026).
Note: Values refer to different dates and instruments and should be read as indications of scale rather than direct comparisons. Blue: investment-grade guarantee or rating; orange: speculative grade; red: high stress.
Figure 4.2. Developments in October and November 2026
13 Oct, Development: IMF Global Financial Stability Report identifies an AI-related correction as one of three salient risks. 14 Oct, Development: Implied yields on CoreWeave notes maturing in 2030-2032 approach 15-16%. 30 Oct, Development: Nasdaq falls 2.9%; S&P Global revises Meta’s outlook to negative. 31 Oct, Development: WSJ: CoreWeave, Nebius and Nscale effectively shut out of the bond market; OpenAI raises USD 11 billion against a USD 30 billion target. 2 Nov, Development: Anthropic’s amended S-1 discloses about USD 895 billion in commitments. 4 Nov, Development: OECD Pensions Outlook 2026: pension assets reach USD 78 trillion at end-2025. 6 Nov, Development: ING offers about USD 500 million of data centre loans for sale.
Source: IMF (2026); Crypto Briefing (2026); Reuters, via Investing.com; WSJ (2026a, 2026b); Anthropic (2026); OECD (2026d); CNBC (2026a).
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Figure 4.2. Developments in October and November 2026: data
Date
Development
13 Oct
IMF Global Financial Stability Report identifies an AI-related correction as one of three salient risks
14 Oct
Implied yields on CoreWeave notes maturing in 2030-2032 approach 15-16%
30 Oct
Nasdaq falls 2.9%; S&P Global revises Meta’s outlook to negative
31 Oct
WSJ: CoreWeave, Nebius and Nscale effectively shut out of the bond market; OpenAI raises USD 11 billion against a USD 30 billion target
2 Nov
Anthropic’s amended S-1 discloses about USD 895 billion in commitments
4 Nov
OECD Pensions Outlook 2026: pension assets reach USD 78 trillion at end-2025
6 Nov
ING offers about USD 500 million of data centre loans for sale
Events since mid-October 2026 show the risk moving from equity to credit markets (Figure 4.2).
The IMF identified an AI-related market correction as one of three salient risks to global financial stability (IMF, 2026).
Figure 4.214 OctImplied yields on CoreWeave notes maturing in 2030-2032 approach 15-16%
Figure 4.230 OctNasdaq falls 2.9%; S&P Global revises Meta’s outlook to negative
At the end of October, CoreWeave, Nebius and Nscale were effectively shut out of the bond market, and their shares fell by at least 30% during the month (WSJ, 2026a; CNBC, 2026b). In private funding markets, OpenAI raised about USD 11 billion against a target of USD 30 billion (WSJ, 2026b).
Figure 4.22 NovAnthropic’s amended S-1 discloses about USD 895 billion in commitments
Figure 4.24 NovOECD Pensions Outlook 2026: pension assets reach USD 78 trillion at end-2025
In the first week of November, ING offered about USD 500 million of data centre loans for sale. This illustrates a tendency for banks to transfer this risk to funds, asset managers and insurers (CNBC, 2026a). Expectations that some US states may tighten permitting for data centre construction could also affect the financing of new projects (CNBC, 2026b).
Source: IMF (2026); Crypto Briefing (2026); Reuters, via Investing.com; WSJ (2026a, 2026b); Anthropic (2026); OECD (2026d); CNBC (2026a).
View data table
Figure 4.2. Developments in October and November 2026: data
Date
Development
13 Oct
IMF Global Financial Stability Report identifies an AI-related correction as one of three salient risks
14 Oct
Implied yields on CoreWeave notes maturing in 2030-2032 approach 15-16%
30 Oct
Nasdaq falls 2.9%; S&P Global revises Meta’s outlook to negative
31 Oct
WSJ: CoreWeave, Nebius and Nscale effectively shut out of the bond market; OpenAI raises USD 11 billion against a USD 30 billion target
2 Nov
Anthropic’s amended S-1 discloses about USD 895 billion in commitments
4 Nov
OECD Pensions Outlook 2026: pension assets reach USD 78 trillion at end-2025
6 Nov
ING offers about USD 500 million of data centre loans for sale
This chapter examines which institutions in the financial system hold AI infrastructure debt. It draws on data from the BIS, the European Insurance and Occupational Pensions Authority (EIOPA), the European Central Bank (ECB) and the OECD, and sets out the limits of current data.
5
Figure 5.1. Private credit to AI-related firms
A. Annual new lending (USD billion), Period: 2010, USD billion: ≈ 3. A. Annual new lending (USD billion), Period: 2025, USD billion: > 40. B. Outstanding stock (USD billion), Period: Current, USD billion: > 200. B. Outstanding stock (USD billion), Period: 2030 estimate, USD billion: 300-600.
Note: The 2030 value in Panel B is an estimated range.
Source: BIS (2026a), Financing the AI boom: from cash flows to debt, BIS Bulletin No. 120.
View data table
Figure 5.1. Private credit to AI-related firms: data
has become a main source of funding for AI infrastructure.
According to the BIS, annual lending by private credit funds to AI-related firms rose from about USD 3 billion in 2010 to more than USD 40 billion in 2025 (Figure 5.1).
The outstanding stock exceeds USD 200 billion, and the share of AI-related loans in private credit has risen from less than 1% to about 8%. This stock could reach USD 300-600 billion by 2030 (BIS, 2026a).
The direct role of banks has remained relatively limited, in part because capital rules may assign higher risk weights to fast-depreciating hardware collateral. However, indirect bank exposure is rising. The IMF reports that loans from US banks to non-bank financial institutions increased by 18% in 2026, and their exposures to private equity and private credit firms by 30% (IMF, 2026).
Note: The 2030 value in Panel B is an estimated range.
Source: BIS (2026a), Financing the AI boom: from cash flows to debt, BIS Bulletin No. 120.
View data table
Figure 5.1. Private credit to AI-related firms: data
A. Euro area: private credit as a share of assets (%), Category: Insurers, Value: 2.3%. A. Euro area: private credit as a share of assets (%), Category: Pension funds, Value: 1.4%. A. Euro area: private credit as a share of assets (%), Category: Banks, Value: 0.2%. B. Insurers planning to increase private credit allocations (%), Category: 2024 survey, Value: 32%. B. Insurers planning to increase private credit allocations (%), Category: 2026 survey, Value: 57%.
Source: Panel A: ECB, via Beinsure (2026). Panel B: Mercer (2026), Global Insurance Investments Survey.
View data table
Figure 5.2. Insurers, pension funds and banks: data
Panel
Category
Value
A. Euro area: private credit as a share of assets (%)
Insurers
2.3%
A. Euro area: private credit as a share of assets (%)
Pension funds
1.4%
A. Euro area: private credit as a share of assets (%)
Banks
0.2%
B. Insurers planning to increase private credit allocations (%)
2024 survey
32%
B. Insurers planning to increase private credit allocations (%)
Long-term investors such as insurers and pension funds are among the final holders of a large part of this debt.
investments of EU insurers reached EUR 514 billion at the end of 2024, or 5.1% of their assets, while occupational pension funds held EUR 128 billion, or 4.4% (EIOPA, 2025). In the euro area, private credit accounts for 2.3% of assets for insurers, 1.4% for pension funds and 0.2% for banks (Figure 5.2, Panel A). An ECB stress exercise finds that insurers and pension funds would be the most affected sectors in a severe private credit shock (ECB, 2026).
Interest from these institutions continues to grow. In a 2026 survey, 57% of insurers plan to increase private credit allocations over the next 12 to 24 months, compared with 32% in 2024 (Mercer, 2026).
OECD data show that pension assets reached USD 78 trillion at the end of 2025, or 106% of the combined GDP of OECD countries (OECD, 2026d). At this scale, even a small portfolio share can represent a large amount.
Source: Panel A: ECB, via Beinsure (2026). Panel B: Mercer (2026), Global Insurance Investments Survey.
View data table
Figure 5.2. Insurers, pension funds and banks: data
Panel
Category
Value
A. Euro area: private credit as a share of assets (%)
Insurers
2.3%
A. Euro area: private credit as a share of assets (%)
Pension funds
1.4%
A. Euro area: private credit as a share of assets (%)
Banks
0.2%
B. Insurers planning to increase private credit allocations (%)
2024 survey
32%
B. Insurers planning to increase private credit allocations (%)
This chapter examines the extent to which obligations linked to AI are disclosed, and how financial institutions are connected to the same AI providers in two different ways.
6
Figure 6.1. Leases signed but not yet commenced
Anthropic, USD billion, 30 September 2026: 451.2. Microsoft, USD billion, 30 September 2026: 364.6. Meta, USD billion, 30 September 2026: 355.7. Amazon, USD billion, 30 September 2026: 164.9. Alphabet, USD billion, 30 September 2026: 130.5.
Note: Each company measures this item under its own accounting policies; the value for Anthropic is an estimated undiscounted obligation.
Source: Company filings with the US Securities and Exchange Commission (Form S-1/A and Form 10-Q), compiled by FourWeekMBA (2026b).
View data table
Figure 6.1. Leases signed but not yet commenced: data
Leases signed but not yet commenced appear in the notes rather than on the balance sheet, and the amounts are very large.
At 30 September 2026, these obligations exceeded USD 1.4 trillion in total at five companies alone (Figure 6.1).
Companies disclose the start dates, terms and cancellation conditions of these obligations in different ways, which makes it harder for investors to compare total leverage.
Note: Each company measures this item under its own accounting policies; the value for Anthropic is an estimated undiscounted obligation.
Source: Company filings with the US Securities and Exchange Commission (Form S-1/A and Form 10-Q), compiled by FourWeekMBA (2026b).
View data table
Figure 6.1. Leases signed but not yet commenced: data
Figure 6.2. The double exposure of financial institutions
1. Dependence as users, Description: Models, cloud and data centre services (third-party and operational risk). 2. Exposure as creditors, Description: Bonds, private credit, ABS, SPV debt (credit and market risk).
Source: Author’s analysis, based on OECD (2026b) and ECB practice.
View data table
Figure 6.2. The double exposure of financial institutions: data
Connection
Description
1. Dependence as users
Models, cloud and data centre services (third-party and operational risk)
2. Exposure as creditors
Bonds, private credit, ABS, SPV debt (credit and market risk)
Financial institutions are connected to the same small group of AI providers in two ways (Figure 6.2).
First, they use the models and cloud services of these firms. The OECD notes that supervisors see dependence on third-party AI providers that are outside the supervisory perimeter as a significant challenge (OECD, 2026b).
Second, they hold the bonds, loans and securitised debt of the same firms, directly or through funds.
These two exposures are usually monitored by different units and under different frameworks.
In early 2026, the ECB started to review both bank lending to the AI sector and banks’ use of GenAI, which shows that the two dimensions can be considered together (Bloomberg, 2026).
Financial distress at one provider could lead at the same time to service disruption and to credit losses.
Source: Author’s analysis, based on OECD (2026b) and ECB practice.
View data table
Figure 6.2. The double exposure of financial institutions: data
Connection
Description
1. Dependence as users
Models, cloud and data centre services (third-party and operational risk)
2. Exposure as creditors
Bonds, private credit, ABS, SPV debt (credit and market risk)
This chapter presents policy options for the risk channels identified in previous chapters. Considerations are expressed more firmly where they draw on existing OECD standards, and as options for discussion elsewhere.
Strengthen disclosure of off-balance-sheet obligations linked to AI
Leases not yet commenced, take-or-pay commitments and SPV obligations are disclosed in different ways across companies. In line with the principles on disclosure of material information in the G20/OECD Principles of Corporate Governance, financial authorities should encourage comparable disclosure of these obligations (OECD, 2023b).
Review valuation assumptions for hardware collateral
Loan maturities span several chip generations, and price indices differ widely. Supervisors could consider comparing the economic life assumptions that lenders and institutional investors use for GPU and TPU collateral with observed chip cycles.
Improve look-through data
The AI-related exposure that insurers and pension funds hold through private credit funds cannot be measured today. Supervisors and statistical agencies could consider identifying this exposure within existing reporting frameworks. The OECD could support this work through its comparative insurance and pension data.
Include AI scenarios in stress tests
The OECD Economic Outlook has called for stress tests that model a sharp correction in AI valuations (OECD, 2026c). Financial authorities could consider extending AI scenarios beyond equity price falls to credit channels such as hardware depreciation, falling token prices and refinancing difficulties.
Monitor user and creditor exposures together
The same AI providers act both as critical third-party suppliers and as borrowers. Within their mandates, supervisors may wish to assess third-party risk oversight and credit risk monitoring together for the same counterparties.
Monitor access by retail investors
Some semi-liquid funds open to retail investors buy data centre loans. Market supervisors may wish to review whether existing rules on liquidity mismatch and risk disclosure are adequate for these products.
Limitations and further work
This paper relies mainly on public reports, company filings and press coverage. Some figures were obtained through secondary sources, and this is indicated in the relevant figure notes. Further work could extend the inventory of documented transactions, classify each transaction by the five channels and prepare simple sensitivity scenarios for representative transactions.
Kahraman, E. (2026, November). Depreciating collateral: Technology risk in AI infrastructure debt and who holds it [Policy paper]. https://depreciating-collateral.vercel.app
Plain text
Kahraman, E. (November 2026), "Depreciating Collateral: Technology risk in AI infrastructure debt and who holds it", policy paper.
BIS (2026a), “Financing the AI boom: from cash flows to debt”, BIS Bulletin, No. 120, Bank for International Settlements, https://www.bis.org/publ/bisbull120.htm.
Reuters (2026), “Alphabet kicks off $6 billion bond sale, tests appetite for tech debt”, 2 November.
Semafor (2026), “AI fears add a 200 basis point premium to SpaceX’s debt”, 26 October.
Steffen, S. (2026), “Inside Nvidia’s $500 billion AI debt machine: a credit analysis”.
The Paypers (2026), “Apollo and Blackstone close USD 35 billion chip financing deal for Anthropic”, June.
TIKR (2026), “Musk predicts death and consolidation for neoclouds as debt markets shut off”, 2 November.
WSJ (2026a), report on neocloud access to bond markets, 31 October, via Techmeme.
WSJ (2026b), “OpenAI raises less than half of $30 billion target in latest round”, 30-31 October.
Note: Some sources were accessed through secondary publications.
Annex A
Researchdesign
This annex summarises the research design of the study.
Table A.1. Components of the research design
Component
Description
Research question
How does the technology cycle of AI affect the quality of the debt that finances AI infrastructure, and where in the financial system does this risk accumulate?
Type of research
Descriptive and exploratory policy analysis; a mixed-methods design that does not forecast.
Unit of analysis
Documented AI infrastructure financing transactions and the types of institutions that are party to them.
Data sources
Reports of international organisations (OECD, IMF, BIS, EIOPA, ECB); company filings with the US Securities and Exchange Commission; rating agency publications; industry surveys; financial press.
Method
1) Document analysis; 2) transaction inventory and content coding by the five channels; 3) simple sensitivity scenarios for representative transactions; 4) mapping of exposures by type of institution.
Validity and reliability
Verification of each figure against a primary source; comparison of several sources (triangulation); clear identification of secondary sources.
Limitations
Limited transparency of private credit data; self-reported surveys; differences between GPU price indices; rapidly changing market conditions.
Ethics
Only publicly available data are used; no assessment of the solvency of individual firms is made; the use of an AI tool is disclosed in Annex B.
Annex B
Noteonpreparation
Claude, an AI assistant developed by Anthropic, was used for the literature search, drafting and preparation of the figures in this study. Anthropic is an AI developer and a buyer of computing capacity within the ecosystem examined in this paper. Examples involving the company are therefore based only on public filings and independent news sources, and are presented using the same criteria as for other companies. Responsibility for the figures and interpretations lies with the author.
Box 2.1 · Key conceptsSpecial purpose vehicle (SPV): a separate company set up to finance a single project. The debt sits on the balance sheet of the SPV, and the company that uses the project is usually only a tenant.
Box 2.1 · Key conceptsTake-or-pay contract: a contract under which the buyer commits to pay whether or not it uses the capacity. Such contracts shift attention from the credit quality of the borrower to that of the buyer.
Box 2.1 · Key conceptsGPU-backed loan: a loan secured on graphics processing units (GPUs) and related lease income.
Box 2.1 · Key conceptsPrivate credit: lending to companies by investment funds rather than banks. Disclosure requirements are more limited than in public bond markets.
Box 2.1 · Key conceptsNeocloud: a specialised cloud provider that rents out computing capacity, mostly on GPUs bought with borrowed money.